Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...
Yan Liu receives funding from Australia Research Council and University of Queensland. Iderlina Mateo-Babiano receives funding from the Australian Research Council, Department of Foreign Affairs and ...
This is a huge leap in flexibility for simulation-based pilot training, which not only makes it easier and simpler for pilots ...
Built on Microsoft Azure's cloud and edge infrastructure, the integration uses Azure Kubernetes Service for orchestration, Azure Entra ID for secure access, Azure Edge Runtime for near-real-time ...
Multi-scale 3D CT imaging enables digital twinning, high-fidelity simulation of composite structures
Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...
Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
Stratasys Digital Anatomy Solution adopted to create Europe’s first 3D-printed anatomical eye models for eyelid surgery ...
Aechelon Technology, Inc. ("Aechelon"), the leading provider of advanced geospatial and visual simulation solutions, today ...
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