SAN JOSE, Calif.--(BUSINESS WIRE)--Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that it will demonstrate the dual-face down (DFD) ...
TOKYO — NEC Corp. and its NEC LCD Technologies unit have developed a system-on-glass display that integrates on a substrate a 230-Kbit DRAM frame memory along with display transistors and peripheral ...
The FINANCIAL — Sony Corporation on February 7 announced the development of the industry’s first 3-layer stacked CMOS image sensor with DRAM for smartphones. The new image sensor consists of a DRAM ...
Digital circuits such as CPUs and SoCs will gain the most from these techniques. However, FPGAs and memory devices also will achieve new highs in density thanks to scaled-down process features. In the ...
If you’re using anything electronic, from a smartphone to a laptop, you’re using Robert Dennard‘s fundamental invention: the single-cell dynamic random access memory chip. While working for IBM back ...
Electronics giant Samsung has become the first silicon vendor to start production of second generation DDR4 RAM chips, built on the 10nm process. The new memory circuits are smaller and more ...
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