Microwave tech is revolutionizing healthcare from diagnostics to wireless implants by enabling noninvasive, connected, and ...

Incize, a Belgian cutting-edge semiconductor characterization and modeling company, and Atomera, a pioneer in advanced semiconductor materials, today announced a strategic collaboration to enhance ...

ETS-Lindgren is pleased to announce VIAVI Solutions Inc. (VIAVI) has successfully completed end-to-end over-the-air (OTA) validation of Metanoia Communications Inc.’s JURA Open Radio Unit (O-RU) at ...

IEEE EMC+SIPI Symposium in Raleigh, NC, offers five days of innovative education, networking, and innovation in EMC, Signal, ...

HUBER+SUHNER is proud to introduce an all-new VITA 67.3 interconnect portfolio designed for use with its proprietary solderless MINIBEND® radio frequency (RF) cable termination technology.

The procurement, testing and deployment of base station antennas – a critical component in the delivery of mobile communications – will be simpler for operators and suppliers thanks to new guidance ...

Advances in MMIC and RFIC technologies are driving 5G/6G and satellite communications with multi-band support, digital beamforming, and emerging sub-THz frequencies, while addressing key challenges in ...

Anritsu Corporation is proud to announce the successful verification and support of 3GPP RAN5 Rel-17 NR NTN test cases on its 5G NR Mobile Device Test Platform ME7834NR.

Learn how Wireless InSite 4.0 simulates dynamic RF environments with moving transceivers, on-body propagation, lunar terrain modeling, and time-based outputs for next-gen wireless systems.

RIGOL Technologies proudly announces the launch of its eighth-generation digital oscilloscope — the DS80000 Series Real-Time Digital Oscilloscopes.

At the IMS in San Francisco in mid-June, everything revolved around microwaves, millimeter waves and optical frequencies. Over 500 exhibitors from 65 countries showcased their solutions. Aaronia AG ...

Connected cars use V2X technology and the 5.9 GHz spectrum to enhance safety, efficiency, and mobility, despite engineering challenges like signal loss, interference, and power demands.