Researchers at Fudan University have achieved a breakthrough by fabricating the first Field-Programmable Gate Array (FPGA) based on wafer-scale two-dimensional (2D) semiconductor materials.
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Direct approach can bond and debond 2D semiconductors without any glue-like materials
A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...
Abstract: Three-dimensional modality is critical for ultrasonic imaging to provide a representative volumetric view of objects, for better evaluation of the shape, size, and orientation of internal ...
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